Assembler Semiconductor Job Description Sample
IC Technical Program Manager-- Leading Semiconductor Assembly Company
This is a Deputy Director position with our client and will focus on IC packaging design wins at top customer, communicating technical requirements from customer to the factories and managing the program engagements. The ideal candidate will have Wafer Level engineering experience and be able to resolve any technical issues, work with factories and manage overall communication.
Required from candidates:
1. BSEE, BSME or IE
2. 8+ years direct experience with Semiconductor package development, particularly Wafer Level packages
3. Strong understanding of the Outsourced Semiconductor Assembly and Test (OSAT) products/services
4. Minimum 3+ years in technical program management role
Semiconductor Assembly Process Engineer
Kforce has a client in Corvallis, Oregon (OR) that is seeking an experienced Semiconductor Assembly Process Engineer to join their technology/engineering client's organization, providing engineering support within a manufacturing environment.
Develop and sustain MEMS packaging manufacturing processes
Use defect analysis and metrology data to improve production processes
Manage the qualification of change process including data collection, risk analysis, completion of appropriately scoped failure modes, and effects analysis (FMEA), justification, and implementation
Tool/process interaction characterization and tool matching projects
Recipe optimization; modify process recipe parameters for reduced manufacturing variation and optimal performance; qualify for use in production; and document methods and results
Train technicians and create documentation that allows transfer of knowledge to other members of the staff
Reduce or eliminate tool exclusions for processes
New tool procurement
Support new acquisition by generating tool and process specifications, testing equipment to determine performance and ensure it meets the specifications, and qualifying each new tool for release to production
Development of new processes: Guide the development of new production methods with analyses of parameters and materials
Research methods used in the brought industry and apply these to client processes
Propose, execute, and analyze experiments to determine feasibility and optimization of new processes
Applying fundamental physics and materials to optimize processes
Minimum of five years manufacturing and process engineering experience in IC/MEMS packaging assembly process, preferable experience in Pick & Place, wire bonding/stud bumping
Experience/familiarity with equipment automation and process development for high volume manufacturing
Experience manufacturing process and other equipment including tool matching, process control, process characterization, defect analysis, metrology, qualifying tools and backup processes and improved process feedback methods
Experience in materials/process engineering: solder, metallization, epoxy a plus
Experience with manual and automated component attach methods, particularly electrical/MEMS components sensitive to reliability/performance a plus
Prior experience in Semiconductor/MEMS advance packaging development is a plus
Experience in molding and assembly of high precision fluidic devices a plus
Working knowledge of failure analysis and characterization
Proficient data analytical skills and good understanding of Statistical Process Control (SPC) * Demonstrated leadership, teamwork/interpersonal, communication and technical skills
Strong written and spoken communication skills
Ability to work and interact effectively with team members from other disciplines, cultures, organizations, and other companies both locally and remotely
Ability to creatively solve problems in a fast-paced product development environment
Fluency in English Desired
Understanding of package qualification and reliability methods and failure analysis
Strong collaboration and communication skills with colleagues and external collaborators Kforce is an Equal Opportunity/Affirmative Action Employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, pregnancy, sexual orientation, gender identity, national origin, age, protected veteran status, or disability status.
Assembly Process Engineer (ON Semiconductor Is Growing!)
Job Summary: ON Semiconductor is seeking a self-driven and motivated professional to join their Assembly Engineering team at the Rochester, NY facility. As an
Assembly Process Engineer with the team, you will have the opportunity to support silicon CCD and CMOS image sensor final assembly with potential focus on processes such as wafer dicing, laser marking, die bonding, wire bonding, and epoxy sealing and curing operations. Additionally, there will be opportunity to support new technology development in the same areas when needed by the business. In doing so, you will join a manufacturing environment that is supportive and quality focused, with decades of image sensor and manufacturing expertise. *Due to the nature of our products at this site, this is an ITAR environment that requires individual to be a US Citizen or permanent resident of the USA.
Performance Objectives: The successful candidate will:
Promptly attend to, and resolve,manufacturing issues that occur over the course of Operations’ shift work.
Organize and analyzemanufacturing process data to improve yields, streamline operations and improvecycle times.
Develop and establishcontrolled processes to support new product and technology initiatives.
Represent AssemblyEngineering in various multi-functional teams while communicating clearly and effectively.
Approach allresponsibilities with a safety and quality oriented mindset.
BS inMechanical Engineering, Microelectronics Engineering, Chemical Engineering,Electrical Engineering, Materials Science or similar discipline.
Willingness to work in a clean room environment and follow strict cleanroom requirements.
Qualified to work in an ITAR environment required.
Experience in an organization directly supporting microelectronicsassembly manufacturing, preferred.
Process engineering statistics background (SPC, DOE). Experience with JMPand MATLAB, preferred.
Experience using AutoCAD, SolidWorks, or similar design software todesign, model, and procure package components for advanced microelectronicapplications, preferred.
Experience with troubleshooting and resolving equipment problems,preferred. ON Semiconductor (Nasdaq: ON) is driving energy efficient innovations, empowering customers to reduce global energy use. The company is a leading supplier of semiconductor-based solutions, offering a comprehensive portfolio of energy efficient power and signal management, logic, standard and custom devices. The company’s products help engineers solve their unique design challenges in automotive, communications, computing, consumer, industrial, medical and military/aerospace applications. ON Semiconductor operates a responsive, reliable, world-class supply chain and quality program, and a network of manufacturing facilities, sales offices and design centers in key markets throughout North America, Europe and the Asia Pacific regions.
Organization:134 OU Truesense Imaging Inc
Title:Assembly Process Engineer (ON Semiconductor is Growing!)
Requisition ID:1704899 ON Semiconductor is an Equal Employment Opportunity Employer and prohibits discrimination on the basis of age, race, color, religion, gender, sexual orientation, national origin, citizenship, protected veteran status, disability status, or any other federal, state or local protected classes. ON is committed to providing equal employment opportunity to qualified individuals, regardless of protect class status.
National Sales - Dsp, Semiconductor IP
DSP, Semiconductor IP National Sales
DSP, Semiconductor IP
Semiconductor IP, BS Electrical Engineering, BSN, Intellectual Property Licensing, Electronic Design Automation Tools, DSP experience Are you interested in working with the world's leading licensor of DSP cores and platform IP? Are you looking for an opportunity to engage customers from a position of strength by representing a company that powers 1/3 of all the mobile handsets in the world, invests heavily in R&D to offer next-generation technologies ahead of competitors, and who can name the world's leading semiconductor and consumer electronics as it's loyal customers? Then please read on!
What You Will Be Doing The Regional Sales Manager will be responsible for acquiring new clients and retaining and expanding business with existing ones in a large territory covering a the specified region of the United States, depending upon where your client base is strongest.
What You Need for this Position Technical Knowledge in the following areas:
Intellectual property licensing
Electronic Design Automation Tools
Intellectual Property (IP) Licensing Professional Sales Experience and Qualifications The successful candidate must have 7+ years selling SW, ASICs, EDA Tools, Intellectual Property Licensing, Semiconductor Marketing, or ASIC design within the Semiconductor Industry or a related OEM. Knowledge of the market landscape of Fabless Companies in the US with contacts at the top-tier players Proven success acquiring new accounts as well as retaining and expanding business with current customer base. Ability to understand complex licensing structure and terms. Ability to effectively negotiate with senior executives. Work effectively and exhibit sales leadership within our team of Local FAEs, Sales Managers, and Marketing to effectively drive business in your territory. A strong and proven knowledge of IP licensing Strong technical understanding of the problems customers are trying to solve with our product offerings. Experience working in a remote environment and travelling to make face-to-face presentations to new and existing clients. Desired but not required Experience in product marketing and/or business development in that industry Prior responsibility for complex contract negotiation Past experience in Intellectual Property business or processor licensing Understands mobile, consumer, automotive, industrial and IoT markets Design experience in VLSI/ASIC Previous Experience in DSP Familiarity with communication standards (e.g. WCDMA, LTE, DTV demodulators, etc.) or Multimedia, or embedded Familiarity with embedded processor designs What's In It for You
Competitive Base Salary and Aggressive Variable Compensation Plan
Generous Paid Vacation Time and Holidays
401K with Match up to 6% Comprehensive Health/Dental Benefits 100% paid by employer So, if you are looking for an opportunity to really excel with the most proven and innovative technology in the industry and have the skills and experience to make an impact, please send me your resume today. Applicants must be authorized to work in the U.S. CyberCoders, Inc is proud to be an Equal Opportunity Employer All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, national origin, disability, protected veteran status, or any other characteristic protected by law.
Your Right to Work – In compliance with federal law, all persons hired will be required to verify identity and eligibility to work in the United States and to complete the required employment eligibility verification document form upon hire.
- DSP, Semiconductor IP* CA-Mountain ViewPMM-1413840
Semiconductor Facility And Process Equipment Engineer
Company Overview Teledyne is an Equal Opportunity/Affirmative Action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, gender, sexual orientation, gender identity, gender expression, transgender, pregnancy, marital status, national origin, ancestry, citizenship status, age, disability, protected Veteran Status, genetics or any other characteristic protected by applicable federal, state, or local law. If you need assistance or an accommodation while seeking employment, please email or call (805)373-4545. Determinations on requests for reasonable accommodation will be made on a case-by-case basis. Please note that only those inquiries concerning a request for reasonable accommodation will receive a response.
Position Summary and Responsibilities
Position Summary: Responsible for the upkeep of facility and process equipment associated with wafer and chip fabrication and other assembly processes plant wide equipment and utilities. Supervise facility and equipment technician team and provide oversight of outside contractors and vendors
Essential Duties and Responsibilities include the following. Other duties may be assigned.
Ensure facility and all systems and equipment at the facility in constant operation
Acts as primary person responsible for all internal and external building structures, including but not limited to: climate control, repairs, damage, driveway salting, etc. Also as primary person responsible for all equipment preventative maintainence.
Determines need for external vendors and contractors through assessment of required work or maintenance; generates statements of work as needed; screens and selects vendors and contractors in collaboration with Purchasing and Management.
Monitors in-house and vendor/contractor performance to ensure that work is completed according to specifications.
Provides leadership and direction of facilities and equipment -related preventive maintenance system, routine facilities and equipment inspections and executes corrective measures as required
In collaboration with EH&S, coordinates with outside regulatory agencies (e.g.,. Fire Department, Building & Safety, Environmental) to maintain all needed regulatory compliance.
Monitor and analyze process performance as well as design, implement equipment upgrades and improve processes.
Design and implement equipment automation improvements, provide process and equipment troubleshooting and optimization
Prepare and execute capital projects on process equipment.
Procure, install, supervise startup, and train users on new equipment.
Plan and maintain preventative maintenance schedules and associated records.
QualificationsQualifications & Competencies To perform the job successfully, an individual should demonstrate the following qualifications and competencies:
Specialized knowledge in one or more of the following: Chemistry, Physics, Thin Film, Photo resist processing, Photolithography, Thermal Processing or Infrared detector operations
Knowledgeable and experienced in process and assembly equipment like CVD system, ion milling, mask aligner, metal evaporators, Dielectric deposition, e-beam and sputtering systems, SRD, die attach, wire-bonder, sealing system, scriber, wet benches, plasma cleaner, etc.
Knowledgeable and experienced in Metrology equipment like Ellipsometer, Profilometer, Microscope, Vacuum Gauge, etc.
Understanding of semiconductor manufacturing process tools, equipment and operations and the interrelationship of facility equipment needed as well as impact of facility systems (DI, power, CDA, LN2) to maintain the manufacturing operations
Working knowledge utilities (mechanical/HVAC/electrical/process) necessary to maintain ISO Class 8 to ISO Class 5 cleanroom environments.
Advanced computer proficiency using Microsoft Word and Excel
Ability to use and troubleshoot various test and facilities equipment
Ability to read and understand mechanical drawings and specifications
Excellent verbal, written and presentation communication skills
Multi-tasking, Working on a team, Strong communication skills and Attention to detail
Displays exemplary ethics and business conduct and performs work cognizant of safe work practice Education and/or Experience
BS & 6yrs or AS & 10 yrs experience in semiconductor processing with exposure to facilities- related mechanical/HVAC/Process Utilities projects. Requisition Post Information : Posted Date* 5/15/2017
Company Name : NameTeledyne Scientific & Imaging
Shift1st Shift - DayCitizenship/Visa RequirementUS Citizen OnlyInternal Code (for CareerBuilder)#CB#
Semiconductor Process Integration Engineering Associate Manager / Goleta, CA
Lockheed Martin - Santa Barbara Focalplane, a leader in focaplane array (FPA) sensor technology, is seeking a semiconductor process integration engineering manager responsible for managing and implementing process development and continuous improvement projects and tasks in support of the production of infrared focalplane arrays and dewar cooler assemblies. Relocation: Relocation assistance is possible for this exciting position.
The Locale: Goleta is a city in southern Santa Barbara County, California. Goleta is part of the central coast region of California and offers lots of great scenery and is a great place to live and to raise a family.
The region is known primarily for agriculture and tourism. Major crops include wine grapes, lettuce, strawberries, and artichokes. Goleta is not too far away from the University of California, Santa Barbara campus.
Much of Goleta is considered to be a quiet suburban community while Santa Barbara tends to attract most of the tourists and the area's residents. Goleta is about 8 miles west of the city of Santa Barbara, along the coast (the coast runs east to west in this portion of southern California). Where can you drive to from Goleta? Goleta is 2 hours northwest of Los Angeles.
San Francisco is about 5 hours to the north of Goleta. Las Vegas, NV is about 5 hours to the northeast. Santa Barbara is filled with history, cultural festivities, and is a premier resort destination nestled between the Santa Ynez mountain range and the Pacific Ocean providing easy access to both scenic mountain hiking as well as the sandy beaches to enjoy in your off time.
Basic Qualifications Bachelors degree in Engineering, Physics or related discipline 6 years minimum of device engineering and processing in an industrial setting 3 years minimum experience in engineering department leadership. Strong semiconductor process engineering knowledge. Familiar with device physics including transistors and detectors Experience with capital equipment procurement and implementation Good project management skills Good presentation skills Desire to mentor and help with career development Possess lean 6 sigma manufacturing discipline Strong knowledge of SPC methodologies Experience with new product introduction and transfer to manufacuturing, Ability to obtain a secret security clearance and therefore must be a US Citizen.
Demonstrated leadership in company culture development and stewardship Desired skills Familiarity with quality management systems. Experience with conflict management. Good employee feedback skills Experience with interfacing with vendors and customers. 3+ years of industry experience, 1 year of which should be having a direct Leadership or team lead role of a team of semiconductor process engineers.
Masters or PhD in Materials Science, Phyiscs, Engineering or related discipline As a leading technology innovation company, Lockheed Martin’s vast team works with partners around the world to bring proven performance to our customers’ toughest challenges. Lockheed Martin has employees based in many states throughout the U.S., and Internationally, with business locations in many nations and territories. Join us at Lockheed Martin, where we’re engineering a better tomorrow.
*Lockheed Martin is an Equal Opportunity/Affirmative Action Employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, pregnancy, sexual orientation, gender identity, national origin, age, protected veteran status, or disability status.
- Job Location(s): Goleta California
Advanced Technology - Principal Investigator In Semiconductor Lasers
Title: Advanced Technology - Principal Investigator in Semiconductor Lasers Location: US-WA-Vancouver
Development Engineer - Hardware & Semiconductor
IBM has announced the OpenPOWER Consortium, partnering IBM Power with other IT companies to leverage architectures unique to POWER to deliver increased value to customers. In addition, POWER and System Z are aggressively shifting focus to Cloud computing and can leverage software acquisitions in this emerging space positioning IBM the rising competitor in Cloud. To further enable this effort, IBM Systems Division has openings for development engineers to support our hardware and semiconductor products. We develop industry-leading hardware for IBM Systems, storage, and related products, including OpenPOWER and System Z enterprise systems. Development engineers participate in various aspects of the development and test process, such as…
Circuit or logic design
Physical design and layout
Mechanical design and technology integration
Thermal and acoustic testing Ideal candidates will possess demonstrated programming design, test, and communication skills. Team-based experience in Digital Signal Processing (DSP), circuit/logic design, power systems, verification, analysis and/or testing is a plus. Candidates with at least three to six months of team-based work experience with hardware products are preferred but NOT required. IBM POWER dominates the UNIX market and now has its sights set on accomplishing the same in Linux. System Z dominates the mainframe market and is growing with Linux offerings and delivering near 0 downtime enterprise computing to emerging countries. The Watson supercomputer is built exclusively on POWER processors. This new ecosystem allows POWER to play an exciting role across many industries including healthcare, transportation, and business analytics; as new customers from different industries continue to engage Watson to tackle their toughest problems.We are designing next generation microprocessors as integral solutions to these important challenges for both POWER Systems and System Z. We are looking for top talent. Join us.
Fundamental or education in hardware programming design and/or test
Strong communication skills
Passion to pursue career path in hardware development IBM is committed to creating a diverse environment and is proud to be an equal opportunity employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, gender, gender identity or expression, sexual orientation, national origin, genetics, disability, age, or veteran status. IBM is also committed to compliance with all fair employment practices regarding citizenship and immigration status.
Semiconductor Process Engineer-Deposition
Title: Semiconductor Process Engineer-Deposition
Job Description: A Semiconductor Process Engineer for Vacuum Deposition is needed by the Microcircuit Emulation Center (MEC) to assist in the manufacturing of microcircuits (integrated circuits) to support the microcircuit obsolescence program and compatible business areas. The successful candidate will have experience in semiconductor processing with an emphasis on vacuum deposition process sustainment and development.
Responsibilities of the position include: • Hands-on process engineering to support low volume microcircuit manufacturing and development. • Primary focus on physical vapor deposition (PVD), in particular sputter deposition of metals. Capability to support other areas as required. • Process development, sustainment, and continuous improvement. • Work directly with cross functional teams (Process Integration, Design and Layout) to address process issues. • Data collection, correlation, interpretation, and presentation of information to management and co-workers. The successful candidate must be able to work in a clean room environment for a significant part of the work day and perform flexible shift work. Opportunities for progression within the group include process integration, production testing, design and marketing.
Auto req ID: 1604BR Location(s): Princeton, NJ
--U.S. Citizenship or U.S. Permanent Residency Required
Employment Status: Full Time
Qualifications: • Candidates should have a degree in Chemical Engineering, Electrical Engineering, Physics or Chemistry. • Due to Government requirements candidates must be a US Citizen or Permanent Resident. • Semiconductor fabrication experience with emphasis in Silicon Bipolar, CMOS technologies, or Analog technologies preferred. This positon is also open to new graduates with some background in semiconductors, and a desire to learn semiconductor fabrication. • Ability to troubleshoot using analytical methodologies in a collaborative team effort across disciplines. • Experience in PVD, sputter deposition of metals, and chemical vapor deposition (CVD) would be advantageous. • History of running PVD sputter system and knowledge of characterization methods. Specific knowledge of running systems manufactured by Trikon or Applied Materials is desired. • Previous patents and publications in semiconductor related areas would be advantageous. • Strong communication skills, both verbal and written. EOE/AA: SRI is an Equal Opportunity Employer, making decisions without regard to race, color, religion, creed, sex, sexual orientation, gender identity, marital status, national origin, age, veteran status, disability, or any other protected class.
Background Check: Employment with SRI International is contingent upon the satisfactory completion of a background check.
Global Commercial VP Semiconductor
Summary: Responsible for revenue generation and growth within the semiconductor market for CoorsTek; includes growing existing key accounts as well as leading strategic marketing efforts to understand growth opportunities within this market. This role will lead the global semiconductor commercial team (e.g. sales, marketing, etc) and will cascade vertical expertise across all commercial teams to achieve a variety of objectives. Roles &
Responsible for sustainable, profitable growth of CoorsTek’s semiconductor market by driving competitive advantage, growing existing customer accounts, acquiring new customers, and launching new products.
Defines the addressable market for CoorsTek, identify target customers, materials and solutions.
Builds and manages the vertical sales team, including Key Account Managers, and drives revenue and strategy objectives within the team.
Represents the broader commercial team in business management (BMT) for this market.
Identifies, develops and maintains business growth opportunities with strategic market customers by building and maintaining strong relationships with key customer contacts including design engineers, scientists, buyers, program managers and executives.
Enables achievement of vertical objectives across the commercial team through hands on account management, assessing market, environment and competition to determine value proposition and defining solution specifications per segment and customer, targeting and positioning appropriately, executing annual plan and applying tools to measure performance.
Drives new product development and growth activities including:
Initiating, developing and defining key customer/market requirements
Acts as technical consultant/liaison to customer teams
Communicates customer needs to the broader CoorsTek organization including engineering and manufacturing teams
Matches customer needs with the best fit CoorsTek factories
Drives, and supports with data, internal decision making on long term growth investments including capital equipment and R&D programs
Develops strategies and cascades to vertical sales team to meet increased revenue and profit goals, including account specific strategic plans.
Develops and maintains a strong understanding of market conditions/trends and customer needs and partners internally with marketing communications and pricing to ensure a united approach.
Creates a collaborative effort between CoorsTek sales, engineering and manufacturing to deliver customer solutions and actively grow the business.
Creates demand for CoorsTek products and solutions though proactive selling and education of customers.
Builds a positive CoorsTek reputation throughout the target market through participation in trade shows, strategic partnering and participation with industry organizations.
Has decisional authority for assigned market/customers/products, specifically for:
Resources (people, systems)
Leads joint planning efforts for assigned vertical account(s) including:Strategic Planning
Provides leadership and vertical expertise to unite commercial efforts including outside and inside sales, sales operations, marketing, and pricing functions.
Bachelors’ Degree in Ceramics, Materials Science, Metallurgy or other equivalent field
MBA preferred Experience:
Twenty (20) years combination of education and work experience that demonstrates the ability to plan and execute extremely complex strategic marketing, new business development and sales or account management processes required
Twenty (20) years of technical sales and/or combination of sales and marketing experience, preferably in ceramics or advanced materials
Twenty (20) years of key account management and strategic marketing experience within semiconductor Functional/Technical Knowledge, Skills & Abilities:
Understanding of the full range of CoorsTek materials, products and market segments or manufacturing and processing of specialty engineered products
Ability to travel internationally /domestically up to 60% of the time
Must be proficient in working with diverse variety of people from different cultures and backgrounds, exhibit strong interpersonal and organizational skills, great attention to detail as well as excellent listening, verbal and written communication skills Note: This job description is not intended to be an exhaustive list of all duties, responsibilities or qualifications associated with the job. #L1-LM1 Requisition Number : 2017-6987 Job Shift: Day External Company URL: www.coorstek.com
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