Chip Unloader Job Description Sample
Rock Chip Repair Specialist
A Repair Specialist acts as the face of Safelite, maintaining our high quality and service standards with a combination of precision auto glass repair and unexpected happiness for our customers. Find a career.
Gain a family. Safelite will be unlike any place you've ever worked. (This won't be just the daily grind!) You'll join caring and passionate teams that collaborate to make a difference, deliver extraordinary results and bring unexpected happiness. Every day.
Your effort, heart and creative ideas will be valued and rewarded. And we care about your well-being. So, we'll strive to give you what you need to be happy at work and at home.
ESSENTIAL ACTIVITIES: Repairs auto glass and installs other Safelite AutoGlass products in store or on a mobile basis in an efficient and timely manner -- focusing on quality workmanship and customer service that goes above and beyond. Takes pride in every repair and the customer experience by demonstrating a positive attitude, and always using approved methods, tools and techniques.
Works safely every day by using protective safety equipment and approved repair protocol to minimize the risk of personal injury. Maintains a working knowledge of their Mobile Resource Management (MRM) device and is a stickler for cleanliness and organization -- ensuring equipment, materials and areas of operation all conform to health and safety regulations and requirements. Committed to accurate and complete work records, and maintaining an acceptable driving record based on company guidelines.
REQUIREMENTS: High school diploma or GED required Knowledge of auto glass repair techniques, customer service, and geographical areas and landmark preferred Knowledge of safe driving practices and basic Safelite Group policies and procedures Ability to lift and carry heavy objects , operate various hand and power tools and equipment, and safely operate a motor vehicle Ability to operate a personal computer and job related software at a basic level, operate a mobile device, and work in a fast-paced environment Skill in providing word class service, verbal communications, and effective listening Skill in performing basic mathematical calculations, accurately handling cash, and performing detailed work Apply now! We're known as an auto glass company. That's the focus of what we do.
But we're much more -- we're a growing and evolving service brand. And what really makes us unique is our people. Because at our core, we're a People Powered organization -- and our people come first and our culture matters.
We'll help you find a fulfilling career path and encourage you to have a life. Let us be the best place you'll ever work
Senior System On Chip Design Engineer
Boeing’s Solid State Electronics Development organization (SSED) within the Boeing Research and Technology (BR&T) organization does microelectronics technology development and design for aerospace systems. We develop digital, analog, and RF Systems on Chip (SoCs) for radar, navigation, electronic warfare, communications and other electronic systems.
These systems are used on Boeing airborne, terrestrial, and satellite platforms. Designs are implemented in various semiconductor technologies including CMOS, GaAs, GaN, and SiGe. We are looking for experienced Integrated Circuit (IC) designers and researchers to support various tasks in the design and test of SoCs.
Tasks include architecture, RTL, synthesis, physical design, verification and test. Boeing is the world's largest aerospace company and leading manufacturer of commercial airplanes and defense, space and security systems. We are engineers and technicians.
Skilled scientists and thinkers. Bold innovators and dreamers. Join us, and you can build something better for yourself, for our customers and for the world.
Typical Education an Experience: Bachelor's with 8 or more years' experience, Master's with 5 or more years' experience or PhD with 2 or more years' experience. Bachelor, Master or Doctorate of Science degree from an accredited course of study, in engineering or physics.
ABET is the Preferred, although not required, accreditation standard. A Bachelor Degree or higher is required. Greater than 5 years’ experience with design and test of complex high performance, mixed digital, and/or analog and/or RF integrated circuits or Systems on Chips (SoCs) and advanced packaging.
Experienced user of IC Electronic Design Automation (EDA) tools. Beneficial to have experience leading small design teams. Beneficial to have experience as principle investigator in research programs, including government sponsored research and development. This position must meet Export Control compliance requirements, therefore a “US Person” as defined by 22 C.F.R. § 120.15 is required. “US Person” includes US Citizen, permanent resident.
JobElect Design and Analysis Engr
Organization:Boeing Research & Technology
Title:Senior System on Chip Design Engineer
AI Research Associate – Chip Technology
Our client, a boutique advance technology invention and patent solutions start-up, has an immediate opening for an AI Hardware/Software Research Associate to play an integral role researching and developing high-value Intellectual Assets that capture key components in existing and future AI chip technology markets. In addition to a degree in Electrical Engineering with advanced studies in AI Chip Technology, our ideal candidate must have excellent quantitative, analytical, and communication skills. Just as important - a positive and upbeat attitude, integrity, and a passion for helping others succeed. This is an associate entry-level position available to recent graduates interested in the field of AI chip technology research.
- Research and assess technology trends, business strategies, and models
- Advanced specification for key technological elements.
- Research & Develop innovative patents
- Become a leader in AI, Big Data, and Augmented Reality based tools and systems development
- Conduct and document a competitive technological analysis
- Support and collaborate with our business analytics team to develop valuation models
- (For the more advanced candidate) Author and present technology research papers
- (For the more advanced candidate) Conduct a business and portfolio strategy assessment
- (For the more advanced candidate) Research & develop future technology mapping in various technology fields
- BS or MS degree in Electrical or Computer Engineering.
- Advanced studies and/or experience in Chip design and ASSP technology.
- Proficient in programming and competency in any of the following: Python, R, Lua, Scala, C++
- Excellent quantitative, analytical, and communication skills
- Communication skills; ability to engage positively with finance and business subject matter experts on challenging problems
Nice to Have:
- Background in architecture and design of ASIC, FPGA, and/or like advanced chip technologies
- Academic or commercial experience in computational statistics, especially applications of machine learning and natural language processing
- Publication of white papers regarding machine learning, natural language processing or AI chip technology
Compensation: $65k to $85K DOE
Questions? If you have any questions, please contact Dale via linked-in at http://www.linkedin.com/in/dalepcorrea
Thank you for your interest!
Optical Wafer And Chip On Wafer Test Engineer
Optical Wafer and Chip on Wafer Test Engineer
Location: San Jose, California, US
Area of Interest Engineer - Hardware
Job Type Professional
Technology Interest *None
Job Id 1222775 WWhat You'll Do As an Optical Wafer and Chip on Wafer Test Engineer you will be working in the Silicon photonics area, Where you’re expected to have Chip level testing experience on both electrical and optical areas. You are also expected to enable and develop Optical/electrical Probing Automation for Chip/Chip on Wafer level testing.
Cisco is looking for an experienced optical/automation test engineer to enable test solutions and characterize and test performance of silicon-based active and passive photonic devices for efficient optical interconnects. This test/automation engineer is expected to be a part of the development team and own the die-level, wafer level and subsystem level testing, mainly focused on Chip on Wafer Optical/electrical testing. The outcome of the job is to deliver the right solution and upstream test coverage in a high production environment.
Cost, timely delivery and quality test solution are essential for the success of the product and are expected out of the test engineer. Collaboration with the design, engineering, component and reliability teams is paramount and the candidate is expected to demo these skills. Here are some of the expertise required o In depth knowledge of test equipment such as scopes, DCA, and other optical instruments to characterize optical signals.
Experience in automated/manual Probers. o Failure analysis skills, Hardware assembly debug skills. o Business intuition and capacity planning o SW and programing skills Who You'll Work With Product Operations is the organization that enables and accelerates innovation to create an unrivaled customer experience & competitive advantage for Cisco through end to end Operations leadership and Product Lifecycle Management. In this role, you will be a key Product Operations team member specifically Supporting the Transceiver Module Group. You will be part of the Test Development Engineering team that defines, Justifies, implements, and validates manufacturing test solutions for Wafer level and /or chip on Wafer level. . Who You Are Min Qualifications ● BS EE Degree, MS EE preferred ● 8+years’ experience on wafer and chip on chip testing and automation ●Knowledgein Python and C# programming. ●knowledge in Optical signal characterization and testing using various optical instruments ●knowledge in Optical Module assembly testing and manufacturing process, starting with Die level testing, to TOSA and ROSA assembly.
Determine test requirements for new products. ● Design test system hardware components where applicable and unique value add ● Debug tester hardware and software, or drive efforts of other engineers doing those tasks. ● Develop Software for tester automation and test instrument drivers. · Design for Testing and Manufacturing Why Cisco We connect everything: people, processes, data, and things. We innovate everywhere, taking bold risks to shape the technologies that give us smart cities, connected cars, and handheld hospitals. And we do it in style with unique personalities who aren’t afraid to change the way the world works, lives, plays and learns.
We are thought leaders, tech geeks, pop culture aficionados, and we even have a few purple haired rock stars. We celebrate the creativity and diversity that fuels our innovation. We are dreamers and we are doers. We Are Cisco. · Cisco is an Affirmative Action and Equal Opportunity Employer and all qualified applicants will receive consideration for employment without regard to race, color, religion, gender, sexual orientation, national origin, genetic information, age, disability, veteran status, or any other legally protected basis.
2Nd Shift Processing Operator- Chip Fry Room
2nd Shift Processing Operator- Chip Fry Room
05-Jan-2018 to 09-Mar-2018 (CST)
Fort Worth, TX, USA
Full Time Email Me Similar JobsEmail Me This Job 2nd Shift: 3:00pm - 11:00pm The Processing Operator Potato Chip Fryer is responsible for the efficient flow of production and quality of product through the auto stir frying process. Essential Job Functions of this role include:
Follows established SOP's and keeps applicable documentation as required.
Operates potato chip fryer, and/or other processing equipment.
Ensures food safety and quality standards are met.
Oversees the operation of the starch recovery system.
Follows proper procedures for pumping oil.
Manages salt level of hopper at all time.
Manages the potato waste bins.
Keeps work station clean and orderly.
Follows all established Good Manufacturing Practices (GMP's).
Immediately notifies Supervisor or Team Lead of any problems.
Operator will conduct boil out procedure of potato chip fryer weekly, and/or processing equipment.
Follow all safety rules and guidelines
Works safely at all times.
May perform other duties as required.
Chip Mill Technician - (Nd10336)
Chip Mill TechnicianPioneer, TNFull TimeEvergreen Packaging is a fiber based packaging solutions company that is one of the largest global packaging companies in the world. Our expertise comes from a long history of satisfying our customers’ needs through innovations in papermaking, barrier technologies, and filling equipment.
Consistently delivering the highest quality paperboard, envelope paper, and publishing papers is both an art and a science. We pour “fresh thinking” into what we do every day in creating value for our customers and our employees.We have positions available at our Chip Mill located in Pioneer, TN. The chip mill is was established in 1996 and produces hardwood chips for Evergreen’s Canton Mill operations.
The Mill rests on the Cumberland Plateau in Eastern Tennessee. Evergreen Packaging’s mill operations have sustained the local economy and generations of families.
Chip Mill TechnicianSafely and efficiently operate chip mill processes to facilitate purchase and delivery of pulp wood and logs to company facilities, including partnering with independent wood suppliers and loggers. The chip mill process the tree length timber into wood chips and transports these related by-products to facilities via truck and rail.Role reports to:
Chip Mill Supervisor
Work safely in compliance with safety rules, regulations and policies which include but are not limited to wearing all safety personal protective equipment (PPE), being safety focused and adhering to OSHA regulations, Evergreen polices and any other applicable regulations.Maintain a positive workplace demeanor at all times to enhance the "team" approach in the workplace and contribute to problem solving issues.Adhere to the Evergreen Packaging’s principle of treating all persons with Dignity and Respect.Demonstrated ability or commensurate experience to operate and maintain equipment which may include but is not limited to log crane, chipper control station, knuckleboom loader, utility tractor, on-site tractor trailer, dump truck, rail loading equipment, wheel loader and any other log handling or processing equipment as required.Perform maintenance and/or repair activities which include demonstrated ability to safely and professionally perform mechanical repairs on mill line components, processing equipment and any other tasks as required.Execute safe and proficient use of hand and power tools.Perform other duties and responsibilities as required.Perform basic computer skill activities as required including record keeping, report completion, use of learning management system and accessing employee self-service for personal data and benefits requirements.Basic
High school diploma or GED is required.Associate’s degree or vocational training is preferred.Two years industrial work experience is preferred. Disclaimer: The above statements are intended to describe the general nature and level of work being performed by people assigned to this classification. They are not to be construed as an exhaustive list of all responsibilities, duties, and skills required of personnel so classified.
Evergreen Packaging is an Equal Opportunity Employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, veteran status, disability, sexual orientation, gender identity or national origin.
Chip Wire Process Engineer
ABOUT THE OPPORTUNITY: Comtech Xicom Technology is seeking a Chip Wire Process Engineer professional to join our team at our Santa Clara, CA.
The ideal candidate will be responsible for the design and validation of advanced microwave and millimeter-wave products. Works closely with planning, procurement, manufacturing, engineering, design/drafting, assembly, test, production personnel and management in the development, design, validation, and deployment of cost effective, reliable products. ABOUT THE COMPANY:
Comtech Xicom Technology, founded as Xicom Technology in 1991, has grown to be a world leading satellite communications (satcom) amplifier supplier, offering the broadest product line in the industry. Our focus on customers, innovation, and quality has driven growth and created a company with a reputation for excellence. Regarded as an industry leader across the board, Xicom provides rugged, highly efficient and reliable Traveling Wave Tube Amplifiers (TWTAs), Klystron Power Amplifiers (KPAs), Solid State Power Amplifiers (SSPAs), and Block Upconverters (BUCs) for commercial and military broadcast and broadband applications around the world.
These Xicom High Power Amplifiers (HPAs) are in use in critical communications links on the ground, in the air and on the sea; they support fixed traditional and direct-to-home broadcast, mobile news gathering, transportable and flyaway systems, secure high data rate communications, and broadband access over satcom. PRIMARY DUTIES: The overall job responsibility is to employ advanced microwave/millimeter-wave concepts to develop complex products/components such as Solid-State Power Amplifiers, Block up Converters etc. in creative and effective ways based upon company objectives.
This includes: • Providing key technical design contributions and strong leadership to execute product developments that meet market needs in a timely fashion. • Carry out Power Amplifier Designs from C band to Ka Band and beyond using GaAs and GaN technologies • Maintaining a positive work environment with participative design process and open communications. • Participating in the strategic product planning process • Responsible for modification, validation, and deployment of the design changes of existing products. • Conducts experimental tests and evaluates results. • Selects and specifies components and equipment based on analysis of specifications and reliability criteria. • Reviews vendor capabilities and makes vendor recommendations • Responsible for oral and written presentations, project planning, design reviews and reports to colleagues and management. • On major product developments, may have primary responsibility and authority for overall project coordination and serve as technical lead for unit integration and share responsibility for key-customer interface. SKILLS REQUIRED: • Computer Skills and/or Tools: Microwave Design SWs such as AWR, ADS, HFSS etc., MS Office • Analyzes product situations or data requiring in-depth evaluation of variable factors. • Exercises judgment in selecting methods, techniques, and evaluation criteria for obtaining results. • Provides direction/leadership to other personnel and be a team player • Possesses knowledge and design experience with microwave (5-26.5 GHz) and/or millimeter wave (26.5-50 GHz) circuits, products, and technologies • Require Hands on Proven experience in design and development of Solid State Power Amplifiers in any of the frequency bands from C Band to Ku Band. • Experience in Microelectronic assembly such as wire Bonding, gap welding will be a plus • Possesses knowledge and design experience with cascaded RF chain design including: gain, amplitude and phase flatness, noise power, intermodulation distortion, spectral re-growth, phase noise, spurious, temperature and vibration induced issues, AM/AM & AM/PM, and phase matching • Proficient in the use of advanced microwave and millimeter wave test equipment and measurement techniques such as network analyzers, spectrum analyzers, power meters etc., EDUCATION / EXPERIENCE REQUIREMENTS: • MS in electrical engineering plus a minimum of 5 years of related experience designing, developing and production releasing of products.
Candidates with BS in Electrical Engineering plus strong experiential background will be considered. Comtech Telecommunications Corp. is an Equal Opportunity Employer.
Field Mechanic - Snack Chip Cooking & Packaging
Snack Chip Cooking & Packaging
- York, PA Seeking experienced field mechanic to travel to customer plants and perform hands-on installation, repair, and training for turnkey food processing systems incorporating ovens, fryers, seasoning systems, packaging, and tray sealing equipment. Activities: Visit customer facilities to install, repair, upgrade, and train operators and technicians on equipment.
Program, troubleshoot, and modify logic for controllers.
Ability and willingness to travel. Hands-on mechanical aptitude.
Familiarity with food production and food packaging equipment. Bilingual abilities, Spanish language preferred. Excellent hourly compensation with overtime and bonus potential.
Senior RF Chip Design Engineer
Senior RF Chip Design Engineer We are seeking a talented Senior RF Chip Design Engineer who is a self-motivated and disciplined team player and team leader with broad but expert skills. The ideal candidate will bring their highly collaborative, strategic, technical and integrative abilities to fulfill this important role.
This full-time exempt position offers a competitive salary and benefits package which include medical, dental and 401(k). The candidate must fulfill the following requirements: 5 years of experience in RF System Architecture and actual Chip Design. Deep understanding of RF architectural tradeoffs, RF Circuits design / layout, Analog Circuit design. The
Chip Level PD CAD Flow And Methodology Engineer
Chip Level PD CAD Flow and Methodology Engineer Job Number: 113134764 Austin, Texas, United States Posted: 11-Oct-2017 Weekly Hours: 40.00
Job Summary You will develop and support the top-level place and route methodology and flow. This flow is used by multiple projects at multiple sites. Strong knowledge of top level place and route flow, UPF, algorithm, scripting (TCL/Perl) and Makefiles are a must. You will interface with physical design teams, CAD team, and EDA vendors. Good communication/interpersonal skills are important.
Key Qualifications * Candidate typically will have 15 years experience in hierarchical ASIC P&R and flow development.
Experience with all aspects of ASIC PD including floorplanning, power-distribution, multi-voltage design, pad ring construction, placement, CTS, and routing.
Understand hierarchical P&R issues including top-level floorplanning, pin-assignment, clock-distribution, critical-signal handling, UPF, MVRC, hierarchical abstractions (black-box, ILM, etc.), and dealing with pad-ring logic/IP.
Strong TCL/Perl/Makefile scripting knowledge. Candidate should have experience developing complex algorithms, managing, and regressing P&R flows.
Candidate should be familiar with chip-finishing issues (metal-fill, spare-cells, DFM rules, boundary-cells, etc.) for the latest generations of process technologies.
We are looking for a self motivated, proactive problem solver. Strong interpersonal/communication skills are a must. * ICC or Encounter knowledge is a plus.
Technical leadership experience is a plus.
Description Provide innovative solutions to improve quality of physical design. Work with chip design teams to implement and customize design flows that are optimal for a given chip. Provide documentation, training and new-user-support. Responsible for diagnosis, resolution, regression of reported problems for multiple projects/sites. Work with CAD team to integrate the flow into the larger infrastructure.
Education BS/MS EE/CS or equivalent
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